Plenary Speakers

Hiroshi Kanazawa

Hiroshi Kanazawa is Head of SiC Research & Development Department of Resonac Corporation. He received M. E. degree in Metallurgy Engineering from Kyoto University and joined Showa Denko K.K in 1995. He received Ph.D. degree based on magnetic material for hard disk from Toyota Technological Institute in 2001. Responsibility for SiC epiwafer business have been started from 2014. Company name has been changed from Showa Denko K.K. to Resonac Corporation from Jan 2023.

Review for Resonac’s SiC Epiwafer Business

Ljubiša Stevanović

Ljubiša Stevanović is the Chief Engineer for Silicon Carbide at GE Aerospace Research in Niskayuna, New York. He leads a multidisciplinary team in the development of vertically integrated chip-to-converter SiC solutions for aerospace applications. His team has also tackled key supply chain challenges by creating partnerships with government and private sector.

Ljubiša received his E.E. Diploma from Belgrade University in 1988, and his M.S. and Ph.D. degrees in Power Electronics from the California Institute of Technology in 1989 and 1995.

A Roadmap for Power Semiconductors in Support of Hybrid Electric Flight

The presentation will outline a roadmap for energy efficient Silicon Carbide (SiC) power semiconductors in support of hybrid electric flight. The author will discuss trends and challenges with performance, reliability, and ruggedness of multi-chip modules used in the development and demonstration of the MW-scale all-SiC power conversion system for hybrid electric propulsion of civil aircraft.

Hans-Günter Eckel

Hans-Günter Eckel has received the Dipl-Ing. degree in electrical engineering from the TU Braunschweig and his Ph.D. degree from the University Erlangen-Nürnberg. He had over ten years of experience in the development of traction converters with Siemens, Nuremberg, when he joined the University of Rostock in 2008, where he is a Professor for Power Electronics and Electrical Drives. His research activities include power semiconductors and converter technology for high power drives and energy applications. He has published over 250 technical papers in these areas. He is an IEEE senior member, member of the EPE ISC and the PCIM advisory board.

Power Semiconductors for Offshore-Windfarms and their Grid Connection

Offshore wind farms are the backbone of a renewable electrical energy supply.

Converters for wind turbines and high-voltage direct current transmission are faced with high demands in terms of power density, efficiency, reliability and costs. This lecture describes the resulting requirements for power semiconductors and analyses which converter and power semiconductor concepts have potential for the future.

Reverse Conducting IGBT for the generator-side converters of direct-drive turbines, hybrid switches for the grid-side converter, Reverse-Blocking IGBT for current source converters as well as ultra-low-sat Si-IGBT and ultra-high voltage SiC power semiconductors for HVDC converters are discussed.

Albert (Budong) You

Albert (Budong) You, Ph.D, Founder, Co-CEO & President of Silergy Corp. (TWSE: 6415), a leading analog and power management IC solution provider based in Asia and publicly listed on Taiwan Stock Exchange. Dr. You has more than 25 years of experience in analog and power management semiconductor industry, and previously served as Director of IC Design and Technology of Volterra Semiconductor. Dr. You currently hold more than 60 US and international patents, and has previously published more than a dozen papers on top international journals including IEEE TED and EDL and served as technical committee member of ISPSD between 2018 and 2021.

Dr. You received his B.S. degree in Electronic Engineering from Zhejiang University, China in 1992, M.S and Ph.D. degree in Electrical Engineering from CPES of Virginia Tech, USA, in 1997 and 2000 respectively.

Power Semiconductor Devices & ICs for IOT and AI

IoT and AI technology will fundamentally facilitate the intelligent development of human society, becoming a pivotal driving force for the human being to enter a new era. Power semiconductors and integrated circuits (ICs) play a critical role in ensuring the efficient and reliable operation of IoT and AI systems. This talk presents an overview about the market size and trend of the end-use applications with IoT and AI. With the increase of AI computing power, third-generation semiconductor and novel 48V architecture have emerged with great advantage in terms of conversion efficiency and power density, which is going to be the key for the entire system. This talk will also discuss about how to achieve efficient power conversion by using Silicon, as well as GaN and SiC power devices. Moving closer to the core power management, advanced BCD process and heterogeneous integration technology realize vertical power delivery for the next generation xPU power management. Modularization, supported by advanced 3D package technology, enables IoT system shrink in size, simplify design complexities, and enhance reliability. In summary, power semiconductors and ICs are fundamental building blocks of IoT and AI systems. As IoT and AI applications continue to proliferate, ongoing advancements in power semiconductor and IC technology will be crucial for driving further innovation and sustainability in these domains.